| PART |
Description |
Maker |
| 2832357 |
Media module with two twisted pair ports for the modular managed switch system
|
PHOENIX CONTACT
|
| CONFIG2 CONFIG0 CONFIG1 DSUMFT311EV |
The FT311D Development Module is a development module which utilises the FT311D IC to develop USB accessories connecting to Android platforms via Android Open Accessory mode.
|
Future Technology Devices International Ltd.
|
| OL6204N-50 OL6204N-50AP OL6204N-50BP OL6204N-BP OL |
From old datasheet system
1.6 um High-Power DIP Module with 9mm Profile
1.6 レm High-Power DIP Module with 9mm Profile
1.6 m High-Power DIP Module with 9mm Profile
1.6 μm High-Power DIP Module with 9mm Profile
Circular Connector; MIL SPEC:MIL-C-26482, Series I, Crimp; Body Material:Aluminum; Series:PT02; No. of Contacts:6; Connector Shell Size:10; Connecting Termination:Crimp; Circular Shell Style:Box Mount Receptacle
|
OKI electronic eomponets
OKI electronic components
OKI[OKI electronic componets]
OKI SEMICONDUCTOR CO., LTD.
|
| PNX1300 PNX1301 PNX1302 PNX1311 |
Media Processors
|
NXP Semiconductors
|
| 050-113 |
Media Converter
|
Glenair, Inc.
|
| EPE6303S |
Media Isolation Transformers
|
PCA ELECTRONICS INC.
|
| W83L518D |
Integrated Media Reader
|
WINBOND[Winbond]
|
| 915G |
Media Expansion Card
|
Intel
|
| PNX1700EH PNX1700EH-G PNX1702EH PNX1701EH-G PNX170 |
Connected Media Processor
|
NXP Semiconductors
|
| PNX1500E PNX1500G PNX1501E PNX1501G PNX1502E PNX15 |
Connected Media Processor
|
NXP Semiconductors
|
| PTM1300FBEA PTM1300 PTM1300AEBEA |
Programmable Media Processor
|
NXP Semiconductors
|
